DescriptionAs we reach the limits of miniaturization in fabrication processes, the interpretation of Moore's law has changed from doubling the frequency every eighteen months to doubling the core count every three to four years (from 2 cores in 2004 to 16 cores in 2015). To reach exascale-level computation, the communication and data transfers between processors and memory is expected to increase drastically; the on-chip interconnect plays a key role in the overall system latency and energy-efficiency. Therefore, novel solutions providing one order of magnitude higher bandwidth and lower energy consumption than what is possible with current electrical interconnects are needed. This poster discusses an optical interconnected compute node that makes use of embedded photonic interconnects together with emerging high bandwidth memory technologies (such as HBM and HBM2). Two different multi-processors architectures with different requirements in terms of number of lasers, high-speed SERDES, and memory bandwidth per processors are presented.