DescriptionLoop Heat Pipe is a two-phase heat-transfer device for providing an effective thermal link between a heat source and a heat sink in cooling systems for HPC. Vaporization and condensation of working fluid circulating inside the loop of tubes provides heat transfer and capillary forces serve as a driving mechanism. Capillary structure acts as a pump without moving parts providing high reliability.
LHP heat transfer technology enables a range of water free cooling solutions for different electronic components like CPU, memory, GPU. Developed for high heat load applications in particular for HPC, they are easily adaptable and work without electric energy consumption.
LHP conception allows a wide variety of different design, which essentially extends the application fields and performance capabilities. LHP leave behind conventional cooling systems due to higher heat-transfer ability, compactness and flexibility. Technology improves productivity, lowers energy consumption, and provides high component density